TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based Apple chip production in the future.

Apple’s chip-making partner TSMC and chip packaging company Amkor announced on Thursday that they’ve agreed in principle to collaborate on chip production, packaging, and testing in their Arizona facilities. The two companies say the close proximities of their facilities in Arizona will accelerate the overall chip manufacturing process:

Taiwan Semiconductor Manufacturing Company (TSMC) has signed an advanced semiconductor packaging and testing deal with Arizona-based Amkor Technology, which has been providing the Taiwanese company with semiconductor assembly and test services for many years.

TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services,

Apple's chip manufacturer TSMC and chip packaging company Amkor on Thursday announced that the two companies have signed a memorandum

Arizona looks like the place to be for US semiconductor manufacturing Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American

TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona.