Having just received a shiny set of PCBs from the fab-house [Devbisme] needed a way to solder the main chip in place. It has a Ball-Grid Array footprint which is notoriously difficult to populate in a ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

Claiming to be ideal for BGA rework and repair, these electrically-conductive, solder-free adhesives are supplied as a dry film on a Mylar carrier and are Z-axis conductive. The adhesives are solvent ...

Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the company. Save my User ...

Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April, according to ...