In the burgeoning Low-Earth Orbit (LEO) satellite market, Taiwanese manufacturers have traditionally found their niche in subcontracting component assembly and antenna integration, rather than carving ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

Due to the continuous expansion of China's mature process capacity and the ongoing requests from downstream customers for price reductions, the industry is very curious about the wafer pricing that IC ...

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC design capabilities; Penang has reached a significant mil ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

How advanced IC designs are replacing board-level systems. How an eFPGA can empower a system’s design. Designers continue to face greater challenges in the development of advanced embedded systems.

In one instance, to further enhance output voltage swing and linearity, the authors propose a novel “breakdown-voltage (BV) ...