Nature

Wafer-scale fabrication of solid-state nanopore array with a novel SpacerX process

Solid-state nanopores (SSNPs) have emerged as a transformative platform in nanotechnology and biotechnology, yet their application is limited by the lack of cost-effective, reproducible fabrication ...
Semiconductor Engineering

Techniques To Identify And Correct Asymmetric Wafer Map Defects Caused By Design And Process Errors

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...
Aerospace and Mechanical Insider on MSN

Robotics driving precision in semiconductor manufacturing

Semiconductor fabrication is a discipline defined by extreme precision, where each stage must meet demanding tolerances to ensure the performance of the final device. The process begins with the ...
Nature

Wafer scale manufacturing of high precision micro-optical components through X-ray lithography yielding 1800 Gray Levels in a fingertip sized chip

We present a novel x-ray lithography based micromanufacturing methodology that offers scalable manufacturing of high precision optical components. It is accomplished through simultaneous usage of ...
Semiconductor Engineering

Semiconductor Device Manufacturing Process Challenges And Opportunities

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
pv magazine International

ITRPV: More work needed to process 210mm wafers

In an update to its annual International Technology Roadmap for Photovoltaics, German engineering association VDMA discusses the readiness level for various technologies in PV cell and module ...
pv magazine International

Longi, ANU develop gettering-based process to improve n-type wafer quality

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
Compound Semiconductor

Element Six and Orbray establish 3-inch diamond process

Element Six (E6) and Orbray have successfully established a reproducible process for 3-inch wafer-scale single crystal (WSC) ...
Business Wire

X-FAB and Exagan Partner to Develop Robust Production Process for High-Volume GaN-on-Silicon Devices on 200mm Wafers

ERFURT, Germany & GRENOBLE, France--(BUSINESS WIRE)--X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient ...
Electronics Weekly

E6 and Orbray establish process for 3-inch diamond wafers

Element Six (E6) of Oxford and Orbray of Tokyo have established a reproducible process for 3-inch wafer-scale single crystal (WSC) diamond, representing a significant step change in size, uniformity ...
Electronic Design

Ring-Oscillator Process Monitors for Wafer-Level CMOS Screening

Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process variation and sorting dies at wafer level. A process monitor is a dedicated ...