Generic test and repair approaches to embedded memory have hit their limit. Smaller feature sizes, such as 130 nm and 90 nm, have made it possible to embed multiple megabits of memory into a single ...

Vincent Ratford, vice president of marketing and business development at Virage Logic (Fremont, Calif.), knows about providing design solutions for IC companies. Earlier, he was director of marketing ...

The Self-Test and Repair (STAR) Memory System enables automated test vector generation, silicon debug, and fault isolation and classification in IC memory designs. Version 4.0 of the memory ...

Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...