Semiconductor Engineering

Package Assembly Design Kits: The Future Of Advanced Package Design

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
Semiconductor Engineering

Package Assembly Design Kits (PADK) Benefits For Packaging Design Engineers

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
Electronic Design

Advanced Package Design Fosters Smaller, More Efficient Semiconductors

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Forbes

Connected Food Packaging: When Technology And Package Design Combine

Patrick Nycz is President of NewPoint, a full-service food and beverage marketing agency, and author of Moving Your Brand Up the Food Chain. In the food business, where the only constant is how fast ...