Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...
The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...
The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...
Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...
IMEC and Vrije Universiteit Brussel (VUB) built and demonstrated an on-wafer liquid phase chromatograph using sub-micron micromachining at last week's IEEE International Electron Devices Meeting. The ...
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