Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
Impact Of The Film Transfer And Grain Size On The Cu-barrier Properties Of 2D WS2 Films (NUS et al.)
A new technical paper titled “Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation” was published by researchers at National University of Singapore, ...
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...
A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...
2026 will continue to shine a spotlight on AI as it reshapes the EDA industry. Those companies that integrate AI into workflows, develop internal talent, and maintain the security posture required for ...
Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...
Programmatic control, AI integration, and automated workflows for high-frequency design.
Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...
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