Cadence Design Systems has unveiled the Tensilica HiFi iQ DSP, the sixth generation of its HiFi digital signal processor family, designed to support emerging voice AI and advanced audio applications.

Rhopoint Components has announced the availability of Exxelia Ohmcraft’s high‑stability precision resistors, expanding its ...

Rapidus sets sights on 2nm chip production as investment interest grows in the government-backed semiconductor foundry.

Blueshift test results indicate that its AeroZero Tapes offer improved passive thermal management for LEO satellites.

CML Micro has launched the CMX918, an ultra‑low‑power, multi‑mode Software‑Defined Radio (SDR) tuner designed to extend ...

Triad Semiconductor has announced the production release of its TS5510 two-channel analogue front end (AFE), a new integrated ...

“We must strive for better,” said IBM Research chief scientist Ruchir Puri at a conference on AI acceleration organised by ...

Diodes Incorporated has introduced the API772x RobustISO family, a new range of dual-channel digital isolators.

Vector Informatik has acquired the RocqStat software technology and specialist team from StatInf, expanding its capabilities ...

Infineon Technologies has launched the EZ‑USB FX2G3, a next‑generation USB 2.0 peripheral controller aimed at improving ...

Emerson has announced an expansion of its NI PXI automated test platform with a new range of high‑performance hardware.

Research shows that lunar soil could be transformed into conductive materials for electronics manufactured on the moon.