GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...

Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, ...

GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New ...

The funds will enable new technologies to be validated and transitioned at scale.

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.