Nvidia shifts to CoWoS-L packaging for Blackwell GPU …
Jan 16, 2025 · As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging technology.
Nvidia reportedly prioritizing dual-die Blackwell GPUs with CoWoS-L …
Jan 15, 2025 · Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.
Nvidia's Blackwell GPUs are sold out for the next 12 months — …
Oct 11, 2024 · Now that packaging issues of Nvidia's B100 and B200 GPUs have been resolved, Nvidia can produce as many Blackwell GPUs as TSMC can. Both B100 and B200 use TSMC's CoWoS-L packaging, and...
Nvidia transitions to advanced CoWoS-L chip packaging, …
Jan 18, 2025 · Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC.
NVIDIA ordering more CoWoS-L advanced packaging from …
Jan 17, 2025 · NVIDIA's new Blackwell AI GPUs have multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology that TSMC makes, with NVIDIA CEO Jensen...
Nvidia, TSMC, and advanced packaging realignment in 2025
Jan 20, 2025 · Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
NVIDIA Renames Blackwell Ultra to B300 Series; CoWoS-L …
Oct 22, 2024 · TrendForce reports that NVIDIA has recently rebranded all its Blackwell Ultra products to the B300 series. Looking ahead to 2025, NVIDIA plans to strategically promote the B300 and GB300 lines—which utilize CoWoS-L technology—thereby boosting the demand for advanced packaging solutions.
Nvidia’s Blackwell Reworked – Shipment Delays & GB200A …
Aug 4, 2024 · Turning to Blackwell Ultra, the mid-generation enhancement of Blackwell, the standard CoWoS-L Blackwell Ultra will be known as the B210 or B200 Ultra. Blackwell Ultra contains both a memory refresh going to up to 288GB of 12 Hi HBM3E and a performance enhancement in FLOPS, up to 50%.
Nvidia CEO says its advanced packaging technology needs are …
Jan 16, 2025 · Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L.
Nvidia delays Blackwell GPUs until 2025, say reports
Aug 5, 2024 · Updated Nvidia is understood to be delaying shipments of its Blackwell GPUs until the first quarter of 2025, and it appears the problems may be due to the complexity of the chip-on-wafer-on-substrate (CoWoS) packaging tech that TSMC is using to …