Deposition is essential to the fabrication process and varies depending on the material used and purpose it serves on a chip. While many methods exist, the five most common are: ◾ Chemical vapor deposition (CVD) ◾ Electrochemical deposition (ECD) ◾ Physical vapor deposition (PVD) ◾ Ultraviolet thermal processing (UVTP) ◾ Pulsed laser deposition (PLD) After more than four decades in the market, we remain one of the top suppliers of deposition technology and solutions. Explore our extensive produc
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Deposition is essential to the fabrication process and varies de…
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We have been a leader in the deposition market for nearly 45 years, ranking among the top suppliers worldwide for deposition tools. Our tools include VECTOR® for plasma-enhanced CVD, Striker® for atomic layer deposition, and ALTUS® for metal ALD/CVD, among others. Dive deeper via the blog. https://bit.ly/4078QSi | Lam Research Corporation
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We have been a leader in the deposition market for nearly 45 ye…
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What is metallization? 🔍 The deposition of metal film, such as molybdenum (Mo), which connects copper interconnects in integrated circuits. Explore how we revolutionize semiconductor metallization using the atomic layer deposition capabilities of ALTUS® Halo to deposit thin Mo films in an integrated circuit. https://bit.ly/4kFN7rH | Lam Research Corporation
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What is metallization? 🔍 The deposition of metal film, such as …
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After 20 years of high-volume, tungsten-based atomic layer deposition, we’re equipping chipmakers with solutions set to power the future of AI. Learn how ALTUS® Halo technology helps enable molybdenum-based metallization for the development of next-generation DRAM and foundry logic devices. https://bit.ly/3FRnipp | Lam Research Corporation
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After 20 years of high-volume, tungsten-based atomic layer depo…
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As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
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As 3D NAND technology advances, the demand for greater depositio…
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As chips continue to shrink in size, the complexity and cost of semiconductor manufacturing increases. Today, we launched Coronus DX, the industry’s first bevel deposition solution optimized to address key challenges in advanced semiconductor manufacturing. Read for more. https://bit.ly/46b4OJg | Lam Research Corporation
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As chips continue to shrink in size, the complexity and cost of semico…
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delive…
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Imagine a workspace where humans and robots work side by side, sea…
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In 1987, our Concept One® PECVD system hit the semiconductor sce…
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Our dry photoresist technology enhances the resolution, producti…
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What’s thinner than a strand of hair but powers your entire digital life…
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Fun Fact: CFET inflection enables logic scaling, allowing a single chi…
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With low resistivity and no barrier layers, molybdenum unlocks the n…
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Step inside of a wafer to see how our tools tackle bonding, dicing, e…
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With ALTUS® Halo, chipmakers gain a solution designed for the next er…
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Three-Minute Legal Tips: Preparing for a Deposition | UW School of Law
Feb 11, 2022
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What is Atomic Layer Deposition (ALD)? | Lam Research posted on …
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"Seed layer: The thin film that starts it all" | Lam Research …
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